HID Global, a secure identity solutions manufacturer, has announced Infineon Technologies AG as a new partner supplying the chips for its ultra-thin Polycarbonate (PC) ePrelaminate inlay for electronic ID (e-ID) cards. The inlays are more than 30 per cent thinner than alternatives, freeing space for added security features. The offering uses patented HID DBond technology, which is available for high frequency (HF) systems.
HID Global’s new inlay takes advantage of its proven process of directly bonding chips to wire-embedded air-coil antennae for low-frequency animal ID and automotive applications, without the bulk of added modules. The company has successfully leveraged its HID DBond technology for HF applications, enabling manufacturers to develop the smallest HF formats available in the market while delivering uncompromised performance. By using this method in its new ultra-thin inlays, HID Global is providing the technology to deliver smart cards with a durable and reliable connection between the card’s intelligence – the microcontroller chip – and its antennae.
“HID Global is committed to providing global smart card manufacturers with solutions to expand the range of products they can offer their customers,” said Rob Haslam, Vice President of Government ID Solutions for HID Global. “We are also proud to add Infineon Technologies as a semiconductor provider to our portfolio of reliable, quality partners assuring the highest quality inlay is available for secure, long-lasting smart cards for government ID applications and programmes.”
In addition, the thinner inlay offers e-ID and smart card manufacturers more flexibility in card construction. The reduced dimensions of HID Global’s ultra-thin inlays – 200 microns instead of the typical 350 microns – provide manufacturers with room to add more security features on both sides of an e-ID card during construction, while still complying with international ISO thickness standards.